ExaKutTM FINISH (FINE GRAIN + ELECTROPOLISH)
It is advisable to use this type of stencil on PCBs that have fine pitch components with a 0,40 mm pitch, CSP, micro BGA, 0201 o 01005.
- Material: Fine Grain stainless steel + Electropolish
- Best transfer of paste for Fine Pitch components: ≥ 95%
NANOCOATING – SURFACE COATING
A thin 2-4 µm coating is applied at inner faces of the pads and at bottom side of the stencil (in touch with PCB side). This coating increases the transfer of solder paste about 2-3% for fine pitch components with a 0,40 mm pitch, CSP, micro BGA, etc. This way the paste residue left on the stencil during the automatic screen printing cleaning process is easily eliminated.
STENCIL LABELING TRACEABILITY
We can laser mark barcodes, Datamatrix codes, references, images or company logos, both on stencils and on any material.